Max. number of layers:
Max. board sizes:
1020 mm *1024mm 500*1200mm
Min. conductor /
spacing width:
Standard: 0.15 mm (6 mil): tolerance +/-20%
Special: 0.10 mm (4 mil): tolerance +/-10%
Min. hole sizes:
Standard: 0.30 mm
Special: 0.20 mm
PTH hole tolerance +/-0.076 mm
NPTH hole tolerance +/-0.05 mm
Basic materials:
Copper thickness:
18.35, 70, 100, 137,206,403 µm + Cu plating
Board thickness:
Standard: 0.50mm,0.60mm,0.80mm, 1.00mm, 1.20mm, 1.50mm, 1.60mm, 2.00mm, 3.00mm,3.2mm,4.0mm.5.0mm.6.0mm,8.0mm
Board surface finish:
HASL(lead free), gold, OSP,Ni/Au,Immersion tin and silver
Solder mask:
photographic-mask, UV or thermal cured mask
Silk screen printing:
Standard: White, Green
Special: Yellow, Black,Aureate,Blue
Standard: 0.4mm – 05.0mm
Standard: Flying Probe Test
Special: Impedance,A shortocircuit test,A test for governance
Required documentation:
Specification + mechanical drawings + data (Gerber files or CAM350)+ drilling files (Excelon) ,CAD protel99se PADS
Delivery cycle
Single side sample Standad:3-4days,batch:7-8days
Double-four layers standad:8-9days,batch:9-10
Six-eight layers:10-20days
Exceed eight layers:15-20days
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